Commit c72ed01d authored by Simon Spannagel's avatar Simon Spannagel
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Add new tests to check material lookup for sensor and support layers

(cherry picked from commit 95966553)
parent 14634447
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# SPDX-FileCopyrightText: 2019-2023 CERN and the Allpix Squared authors
# SPDX-License-Identifier: MIT

#DESC tests if a warning will be thrown if the material of the passive material is the same as the material of the world volume.
[Allpix]
detectors_file = "detector_support_material.conf"
number_of_events = 0
random_seed = 0

[GeometryBuilderGeant4]
log_level = "TRACE"
world_material = "air"

#PASS (TRACE) [I:GeometryBuilderGeant4] Found material "gallium_arsenide" in internal database
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# SPDX-FileCopyrightText: 2019-2023 CERN and the Allpix Squared authors
# SPDX-License-Identifier: MIT

#DESC tests if a warning will be thrown if the material of the passive material is the same as the material of the world volume.
[Allpix]
detectors_file = "detector_support_material.conf"
number_of_events = 0
random_seed = 0

[GeometryBuilderGeant4]
log_level = "TRACE"
world_material = "air"

#PASS (TRACE) [I:GeometryBuilderGeant4] Found material "G4_SILICON_DIOXIDE" in Geant4 NIST Database
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# SPDX-FileCopyrightText: 2023 CERN and the Allpix Squared authors
# SPDX-License-Identifier: MIT

[mydetector]
type = "test_support"
position = 0 0 0
orientation = 0 0 0
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# SPDX-FileCopyrightText: 2017-2023 CERN and the Allpix Squared authors
# SPDX-License-Identifier: MIT

# Type of the detector model
# A "hybrid" consists of sensor plus bump-bonded readout chip
type = "hybrid"
# The "pixel" geometry describes a sensor with rectangular pixel on a Cartesian grid
geometry = "pixel"

# Size of the active pixel matrix (columns and rows)
number_of_pixels = 5 5
# Pitch of one individual pixel (column and row pitch)
pixel_size = 220um 440um

# Thickness of the active sensor material
sensor_thickness = 400um
# Excess sensor material outside of the active pixel matrix
# Specifying one value will add the excess to all four sides
sensor_excess = 100um

sensor_material = "GALLIUM_ARSENIDE"

# Parameters for bump bonds consisting of sphere and cylinder
bump_sphere_radius = 90um
bump_height = 200um
bump_cylinder_radius = 70um

# Thickness of the hybrid's readout chip
chip_thickness = 200um
# Excess of the chip material
# Specifying individual values for top, bottom, left, right
# allows to define asymmetric excess material
chip_excess_top = 150um
chip_excess_bottom = 150um

# Support layer of the assembly
# The support material defaults to G10 (PCB)
[support]
# Thickness of the support layer
thickness = 165um
# Dimensions in x an y
size = 4mm 4mm
# Offset of the support with respect to the sensor center
offset = 0.3mm 0
# Size of the optional cut-out in the support
hole_size = 1.5mm 1.5mm
# Position of the cut-out
hole_offset = -0.25mm 0
# material from Geant4's NistManager:
material = "G4_SILICON_DIOXIDE"