Merge branch 'timepix4' into 'master'

# Timepix4 with 2x448x256 pixel matrices, three hidden peripheries

# Here, additional 450um excess are added at top and bottom edge for wire-bond pads.

# Remove for TSV chip version.

type = "hybrid"

number_of_pixels = 448 512

pixel_size = 55um 55um

sensor_thickness = 300um

sensor_excess = 1mm

bump_sphere_radius = 9.0um

bump_cylinder_radius = 7.0um

bump_height = 20.0um

chip_thickness = 700um

chip_excess_left = 30um

chip_excess_right = 30um

chip_excess_top = 450um

chip_excess_bottom = 450um

[support]

thickness = 1.76mm

size = 47mm 79mm

offset = 0 -17.25mm